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英偉達(dá)正在考慮對其下一代Blackwell B300 AI GPU采用插座式設(shè)計，這一改變將使用戶能夠自行更換用于AI和HPC應(yīng)用的GPU。
根據(jù)TrendForce的報告，這一設(shè)計變更可能會應(yīng)用于代號為GB300的產(chǎn)品。不過目前這些信息的可信度尚不確定，但供應(yīng)鏈中的討論使得這一可能性值得關(guān)注。MoneyDJ的報道指出，英偉達(dá)可能出于對AI GPU高負(fù)載下的故障率、主板更換成本和冷卻問題的考慮，而采用插座式設(shè)計，以此替代將GPU焊接到主板上的現(xiàn)行做法。 CLSA的分析師陳爍文提到，英偉達(dá)可能從GB200 Ultra開始就為其產(chǎn)品設(shè)計GPU插座，并可能采用帶有英偉達(dá)CPU的四路英偉達(dá)GPU設(shè)計。然而他提到，采用插座式設(shè)計將會增加電源和冷卻的挑戰(zhàn)，而不是減輕它們，這與一些報告的預(yù)期相反。目前，英偉達(dá)的GB200平臺對CPU和GPU都使用BGA封裝，對于即將到來的B200 Ultra更新版本是否會帶來改變，目前尚不確定。 英偉達(dá)的數(shù)據(jù)中心產(chǎn)品線包括了多種GPU和CPU平臺，如A100、H100、B100/B200以及GH100、GB200等。這些產(chǎn)品的設(shè)計和封裝方式對于其性能和可維護(hù)性有著重要影響。標(biāo)準(zhǔn)的CPU插座雖然易于維修和升級，但在服務(wù)器環(huán)境中，它們比BGA封裝或SXM/OAM模塊占用更多空間，并帶來更嚴(yán)格的電源和熱管理限制。 目前，英偉達(dá)的大多數(shù)SXM模塊（Scalable Accelerator Module，SXM模塊是一種專為數(shù)據(jù)中心設(shè)計的高性能、高功率GPU模塊，支持通過專用的SXM插槽進(jìn)行連接）由富士康制造，而從模塊轉(zhuǎn)向插座設(shè)計可以降低成本，但也會限制性能。
英偉達(dá)已經(jīng)正式推出了其B200 GPU，這是一款功率超過1000W的高性能圖形處理器。B200 GPU被設(shè)計用于GB200主板，這些主板有代號Ariel和Bianca兩種版本。Ariel主板配備了一個Ariel CPU和一個Blackwell GPU，而Bianca主板則配備了一個Grace CPU和兩個Blackwell GPU。這些配置使得B200 GPU能夠以BGA形式出現(xiàn)，直接焊接到主板上，以實(shí)現(xiàn)更高的性能和能效。英偉達(dá)還推出了Umbriel GPU主板，這些主板支持多達(dá)八個B200（1000W）和B100（700W）GPU，采用SXM模塊形式。 此外，根據(jù)SemiAnalysis的說法，英偉達(dá)還計劃推出代號為Miranda和Oberon的GB200平臺。這些新平臺預(yù)計將提供更高的性能，包括支持PCIe 6.0和800G網(wǎng)絡(luò)連接，以及更高的TDP（Thermal Design Power），這預(yù)示著它們將能夠提供更多的計算能力，同時也需要更復(fù)雜的冷卻方案。 英偉達(dá)已經(jīng)推出了基于Hopper架構(gòu)的H100和H200插入式卡，但尚未宣布任何帶有基于Blackwell的GPU的插入式卡。不過，有非官方信息顯示，英偉達(dá)正在準(zhǔn)備代號為B200A的產(chǎn)品，這是一款基于單體B102處理器的產(chǎn)品，通過TSMC的CoWoS-S封裝技術(shù)連接了四個HBM3E內(nèi)存堆棧，與之前的B100/B200設(shè)計不同。 B200A可能采用多種形式因素，包括SXM模塊設(shè)計和插入式卡形式因素，甚至可能是插座式設(shè)計。這種設(shè)計上的靈活性可能預(yù)示著英偉達(dá)在數(shù)據(jù)中心GPU領(lǐng)域的未來發(fā)展方向。
NVIDIA Blackwell Ultra “B300” AI GPUs For GB300 Servers Might Utilize A Socketed Design NVIDIA's Blackwell Ultra B300" GPUs may introduce a docketed design on GB300 servers, which will make maintenance and upgrades easier. With a socket-based design, NVDIDIA's Blackwell Ultra "B300" AI GPUs could be utilized just like CPUs
However, this could be the last series featuring the onboard design as several reports suggest that NVIDIA could move to a different design with the Blackwell B300 "Ultra" GPUs for GB300 servers. As per MoneyDJ and Economic Daily News (via Trendforce), the B300 GPUs could feature a socket-based design, which will allow the users to install or uninstall the GPUs from the motherboards. The socketed approach on NVIDIA's Blackwell Ultra "B300" AI GPUs approach is said to simplify the manufacturing process for NVIDIA and can benefit several companies, especially the Taiwan-based Foxconn and LOTES, which produce interconnect components and sockets. The current Blackwell GPUs are soldered directly to the motherboard and with the transition to a socket-type design, the B300 GPUs could be removed from the motherboard just like CPUs.
With this transition, there will be several benefits including improved yield rate and flexible production as the GPU won't have to be soldered into the socket and NVIDIA wouldn't need to rely on Surface Mount Technology. Moreover, the process will simplify the maintenance and after-sales services as the whole motherboard won't have to be replaced in cases of GPU-related problems. As a result, the upgrades could reduce the overall time for downtime when the GPUs are changed and it will help companies to offer more reliable servers to their customers. However, it is expected that the new socket design will introduce some performance reduction as this will introduce some higher latency. Nonetheless, if maintenance, upgrades, and better yields are improved, the trade-off will be worth the design transition.
Another important change with the B300 is the adoption of FP4(Floating Point 4), which benefits inference. Inference is how the trained models make predictions on data and serves as a crucial aspect of AI computation. The B200 is already exceptional in AI workloads and has already been deployed by various companies. Meanwhile, the B300 "Blackwell Ultra" is expected to enhance its performance significantly but surprisingly, it won't be the first to feature the socket-based design as AMD already introduced this design with its MI300A chips introduced in 2023.
By Anton Shilov published 3 days ago GB200 Grace Blackwell Superchip MoneyDJ reports that considering the failure rates of AI GPUs under high loads, the replacement costs of motherboards, and cooling challenges, Nvidia and other AI GPU designers might consider using socket designs for their next generation of GPUs instead of soldering GPUs to motherboards. EDN cites Chen Shuowen, an analyst with CLSA, as saying that based on supply chain checks, Nvidia has been designing GPU sockets for its products, possibly starting with the GB200 Ultra. Chen reportedly mentioned a 4-way Nvidia GPU design with one Nvidia CPU. Neither of the reports mentions anything called GB300, so TrendForce has added this part, possibly based on some additional chatter. Several things about the reports should be noted. Socketed designs would instead add to power and cooling challenges rather than help solve them, so the first report is inaccurate. The most power-hungry GPUs usually use BGA packaging. A 4-way Blackwell GPU with one CPU motherboard does not look extraordinary, considering that with DGX servers, we see an 8-way GPU baseboard and a 2-way CPU motherboard, yet such a design looks incredible. Nvidia's data center nomenclature divides the company's GPU (A100, H100, B100/B200) and Grace CPU + GPU platforms (GH100, GB200). For now, GB200 platforms use BGA packaging for both CPU and GPU; we are not sure something has to change with the B200 Ultra refresh, especially with the possible GB200 Ultra refresh sometime in the second half of the year. We all love standard CPU sockets for their easy repairs and upgradeability. But in servers, they take up more space and have more power and thermal constraints than BGA packages or SXM/OAM modules. While the modules provide reparability, the process might vary depending on the specific motherboard design, and removing an OAM/SXM module requires careful handling, so they are not as good as sockets.
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